The Rapid heating and cooling circuit flow rate result shows the flowrate of the fluids in the rapid heating and cooling circuit during the analysis, for both dual domain and 3D analyses. This result is generated from a rapid mold heating and cooling simulation using a Transient Cool analysis.
The Rapid heating and cooling circuit flow rate result is best used in conjunction with the data in the analysis log. The analysis log indicates when the program transitions to the next step and thereby helps you understand what is happening when looking at the circuit flow rate result.
When looking at the Rapid heating and cooling circuit flow rate result, there are three times when there is measurable flow rate; during the primary air purge, when coolant is flowing through the lines, and during the secondary air purge. At some time, as indicated in the programming, there will be an air purge to clear the lines of steam ready for cooling, and you will see the circuit flow rate increase dramatically. The flow rate will then fall drammatically while coolant is passed through the lines, then the secondary air purge will cause another large increase in flow rate. The lines are then filled with steam. During the steam heating part of the program, there is no measurable flow rate.
When viewing the Rapid heating and cooling circuit flow rate result, watch for the following.