Temperature, mold-circuit interface (averaged) result

The Temperature, mold-circuit interface (averaged) result is an elemental result averaged over the cycle, and shows the temperature of the metal cooling circuits, calculated using the finite element method (FEM).

Using this result

The temperature distribution should be evenly distributed on the cooling circuits. The temperature will increase where the circuit nears the part, and these hotter regions will also heat the coolant. The temperature should be no more than 5°C greater than the inlet temperature.

If the circuit temperature is too hot in these areas, consider the following resolutions:

• Increase the flow rate of the coolant.
• Make the cooling circuit larger and increase the flow rate of the coolant to maintain the Reynolds number.
• Add cooling channels in the area of the hot metal temperature.

Things to look for

When viewing the Temperature, mold-circuit interface (averaged) result, watch for the following:

• Mold hot spots.
• Circuit coolant temperature result.