The Maximum wire sweep index - Wire number: XY Plot result shows the maximum wire sweep index value of each wire in the model.
The Maximum wire sweep index - Wire number: XY Plot result is generated by a 3D Microchip Encapsulation analysis when the selected analysis sequence includes Wire Sweep.
The single maximum value of the wire sweep index predicted for each wire is plotted versus the wire number.
Using this result
Use this information to identify individual wires that undergo the greatest drag force during cavity filling.
Note: In order to calculate the Maximum wire sweep index - Wire number: XY Plot result, the wire sweep calculation must be performed in Autodesk Simulation Moldflow Insight.
Tip: This option is set on the Microchip Options tab of the Reactive Molding solver parameters (3D) dialog. Double-click 
Process Settings in the Study Tasks pane, or click 
() to open the Process Settings Wizard. Click Next to display the Profile Settings page; click Advanced options; click Edit in the Solver parameters area; and click the Microchip Options tab. Set the Perform wire sweep/paddle shift simulation in option to Autodesk Simulation Moldflow Insight.
Process Settings in the Study Tasks pane, or click () to open the Process Settings Wizard. Click Next to display the Profile Settings page; click Advanced options; click Edit in the Solver parameters area; and click the Microchip Options tab. Set the Perform wire sweep/paddle shift simulation in option to Autodesk Simulation Moldflow Insight.