The Wire pairs within critical clearance result shows number of wire pairs for which the predicted clearance after wire deformation is equal to or less than the specified critical clearance value.
The Wire pairs within critical clearance result is generated by a 3D Microchip Encapsulation analysis when the selected analysis sequence includes Wire Sweep.
The plot shows the number and location of wire pairs for which predicted clearance between the wires is within the critical clearance.
Note: The Critical clearance between wires value is specified in the solver parameters. The default value is zero, indicating that the surfaces of adjacent wires can touch.
Using this result
Use this information to identify pairs of wires that are too close together after wire deformation occurs during cavity filling.
Note: In order to calculate the Wire pairs within critical clearance result, the wire sweep calculation must be performed in Autodesk Simulation Moldflow Insight.
Tip: This option is set on the Microchip Options tab of the Reactive Molding solver parameters (3D) dialog. Double-click 
Process Settings in the Study Tasks pane, or click 
() to open the Process Settings Wizard. Click Next to display the Profile Settings page; click Advanced options; click Edit in the Solver parameters area; and click the Microchip Options tab. Set the Perform wire sweep/paddle shift simulation in option to Autodesk Simulation Moldflow Insight.
Process Settings in the Study Tasks pane, or click () to open the Process Settings Wizard. Click Next to display the Profile Settings page; click Advanced options; click Edit in the Solver parameters area; and click the Microchip Options tab. Set the Perform wire sweep/paddle shift simulation in option to Autodesk Simulation Moldflow Insight.