- This tutorial uses the meshed model created in the Circuit Board CAD Model tutorial. If this tutorial was not completed, use Meshed Circuit Board.ach in your tutorial models folder.
- The chip is made of silicon.
- The board and RAM slots all have a thermal conductivity of 5x10
-5
Btu/(s·°F·in).
- The exposed portion of the top surface of the board and all the exposed surfaces of the RAM slots and chip transfer heat through convection to an ambient temperature of 80°F with a convection coefficient of 8x10
-6
Btu/(s·°F·in
2
).
- The bottom and the four edges of the board are insulated.
- The chip has an internal heat generation of 0.00311 Btu/(s·in
3
).
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