- With the
Selection 
Shape Point or Rectangle and 
Selection Select Surfaces commands active, click the top surface of the board. - Click
Setup Thermal Loads Convection. - In the Convection Coefficient section, type 8e-6 in the Temperature Independent Convection Coefficient field.
- In the Ambient Temperature section, type 80 in the Temperature field.
- Click OK to apply the convection load to the model.
Note: Surface-splitting was enabled when the CAD model was opened in Autodesk Simulation (in the
Mesh Circuit Board CAD Model
tutorial). Therefore, the convection load is only applied to the exposed portion of the top surface. The portions under the chip and edge connectors are separate surfaces because surface-splitting splits surfaces where they intersect the edges of adjacent parts in an assembly.
Surfaces that do not have a load applied in Autodesk Simulation are considered to be perfectly insulated.
Next, additional work is required for the exposed surfaces of the chip and RAM slots.