Modeling for an Underfill Encapsulation analysis

There are modeling guidelines for an Underfill Encapsulation analysis.

• To model the cavity under the chip, assign the Part surface property to the cavity mesh elements.
• At present, flow outside the chip cannot be analyzed, because only the cavity under the chip is modeled.
• The thickness of the cavity under the chip is assumed to be uniform.
• The nodes where the dispensing occurs are modeled as the injection location.
• For accurate analysis, you must model each solder individually.
• To model the region away from the solders, use a shape factor of 1.
• To model the region near the solders, calculate a shape factor by using the following equation:

  shape factor = (actual area of solid wall in thickness or planar direction) / (area of solid wall used in the simulation)