Microchip Encapsulation analysis types and analysis technologies

The following table shows the available analysis technologies for a Microchip Encapsulation analysis type.

There are two solvers that can be selected when doing Midplane or Dual Domain analyses:

The analysis sequences that are available depend on the mesh type you are using.

Microchip Encapsulation process and analysis types
Analysis Type Analysis Technology
Fill Midplane Dual Domain
Fill+Pack (or Flow) Midplane Dual Domain 3D
Fill+Pack (or Flow)+Wire Sweep Midplane Dual Domain 3D
Wire Sweep Detail 3D
Fill+Pack (or Flow)+Paddle Shift Midplane Dual Domain 3D
Fill+Pack+Dynamic Paddle Shift 3D
Fill+Pack (or Flow)+Wire Sweep+Paddle Shift Midplane Dual Domain
Fill+Pack+Dynamic Paddle Shift+Wire Sweep 3D
Fill+Pack+Warp Midplane Dual Domain 3D
Warp1 Midplane Dual Domain 3D
Runner Balance Midplane Dual Domain
Venting (Process Settings option) 3D
Cool (FEM) 3D
Cool (FEM)+Fill+Pack 3D
Cool (FEM)+Fill+Pack+Wire Sweep 3D
Cool (FEM)+Fill+Pack+Wire Sweep Detail 3D
Cool (FEM)+Fill+Pack+Paddle Shift 3D
Cool (FEM)+Fill+Pack+Dynamic Paddle Shift 3D
Cool (FEM)+Fill+Pack+Paddle Shift+Wire Sweep 3D
Cool (FEM)+Fill+Pack+Dynamic Paddle Shift+Wire Sweep 3D
Cool (FEM)+Fill+Pack+Warp 3D
Parent topic: Microchip Encapsulation analysis
1 To complete a Warp analysis for Midplane or Dual Domain analysis technology, you must select an analysis sequence that includes the Compressible solver.