Microchip Encapsulation analysis log

The Microchip Encapsulation analysis log is a text report that lists the inputs that you used for the analysis, including solver parameters, material data, process settings an model details, followed by the analysis progress tables.

There is a separate table for the injection phase, and for the curing phase of the analysis. The Analysis Log is a text report generated by the Microchip Encapsulation analysis.

Using the analysis log

The Analysis Log for a Microchip Encapsulation analysis can be used to determine whether the part filled completely during injection before the curing phase began.

Look at the analysis progress table for the injection phase and check whether 100% of the cavity volume filled. If this did not occur, then you may see a message stating "The maximum machine injection pressure was reached at ...", followed by **SHORT SHOT**.

Note: View the Warp/Stress Analysis Log for information on the wire sweep/paddle shift analysis.

Things to look for

Short shot

If this problem occurs, try changing the following process settings (in the order presented) and re-run the analysis.

1. Melt and mold temperatures (primary)
2. Fill time (primary)
3. Pressure (secondary)

Note: Adjustments such as those above can only be made using a licensed Autodesk Simulation Moldflow Adviser or Autodesk Simulation Moldflow Insight product.