Wire Sweep/Paddle Shift tab

The Wire Sweep/Paddle Shift tab of this dialog is used to specify input parameters for wire sweep and paddle shift prediction for a Microchip Encapsulation analysis with a Midplane or Dual Domain mesh type.

Note: Wire deformation during the Microchip Encapsulation process can be quite large so we recommend that a Large Deflection Stress analysis be run in either Autodesk Simulation Moldflow Insight or Abaqus.

Stress analysis type	This option is used to select the type of Stress analysis to run to predict paddle shift/wire sweep.
Perform wire sweep/paddle shift simulation in	If the analysis sequence includes wire sweep and/or paddle shift simulation, this option is used to specify which solver will be used to perform this simulation.