Modeling the wire for microchip encapsulation analysis

To prepare the model for a Microchip Encapsulation wire-sweep analysis, model the wire together with the mesh. The mesh for wire-sweep analysis and Fill+Pack analysis will be internally separated during execution. The procedure to model the wire is outlined below:

1. Click (Home tab > Molding Process Setup panel > Microchip Encapsulation) and select Microchip Encapsulation.
2. Create the curve(s) to represent the wire geometry.
3. Click (Geometry tab > Properties panel > Assign).
4. Click Select, then Wire from the drop down list.
5. Select the appropriate wire type in the Select Wire dialog, and check that the Details are correct.
6. Click Select to close the Select Wire dialog.
7. Click OK to close the Assign Property dialog.
8. Generate the mesh.
   Note: For analysis sequences including Wire Sweep or Wire Sweep Detail analyses, mesh the wires as 1D beam elements.

Note: You need to specify boundary conditions at the two ends of each wire. The boundaries should have zero x-, y-, and z-displacements, and zero x-, y-, and z-rotations.