Running a wire sweep analysis

Ensure you have specified microchip encapsulation as your molding process.

1. Click (Home tab > Molding Process Setup panel > Analysis Sequence).
2. In the Select Analysis Sequence dialog, select Fill+Pack+Wire Sweep or Fill+Pack+Wire Sweep Detail and then click OK.
3. If these options are not visible, click More to show additional analysis options.
4. If necessary, double-click from the Study Tasks pane to change the Material properties.
5. If necessary, double-click from the Study Tasks pane to edit the Process Settings properties.
6. Click (Home tab > Analysis panel > Start Analysis).

Note: Click (Home tab > Analysis panel > Job Manager > Abort Job) to abort the analysis.