The Underfill Encapsulation process settings dialog is used to specify default values for the analysis inputs to an Underfill Encapsulation analysis.
To access this dialog, click 
(), select Geometry/Mesh/BC from the Category drop-down menu and select Dispensing location from the Property type menu.
| Curing temperature | The temperature at which a thermoset material will become sufficiently cross-linked from heating to form a solid, or cure. |
| Curing time | The time taken for a thermoset material to become sufficiently cross-linked from heating to form a solid and freeze. |
| Initial encapsulant temperature | Specify the temperature of the encapsulant at the start of the process as it enters the chip cavity. |
| Initial encapsulant conversion | Specify the initial conversion (curing) level of the encapsulant before the start of the process. |
| Substrate temperature | Specify the temperature of the substrate during the process. |
| Dynamic dispensing analysis | Check this box to enable dynamic dispensing. Dynamic dispensing allows you to simulate underfill encapsulation dispensing that is completed over several passes, and where each injection location is open at a different time to account for the time delay during dispensing. |
Note: The values used for the current analysis sequence may be changed by entering the desired values on the Process Settings Wizard-Underfill Encapsulation Settings dialog.