The Wire number result graphically shows the identification number assigned to each wire.
The Wire number result is generated by a 3D Microchip Encapsulation analysis when the selected analysis sequence includes Wire Sweep.
The analysis assigns the wire identification number based on the node number of each wire node. A wire that has a smaller node number will be assigned a lower wire number. The wire that has the lowest node number is assigned the wire number one.
Using this result
Use the animation controls to more easily identify the locations of individual wires in the graphical display.
Note: In order to calculate the Wire number result, the wire sweep calculation must be performed in Autodesk Simulation Moldflow Insight.
Tip: This option is set on the Microchip Options tab of the Reactive Molding solver parameters (3D) dialog. Double-click 
Process Settings in the Study Tasks pane, or click 
() to open the Process Settings Wizard. Click Next to display the Profile Settings page; click Advanced options; click Edit in the Solver parameters area; and click the Microchip Options tab. Set the Perform wire sweep/paddle shift simulation in option to Autodesk Simulation Moldflow Insight.
Process Settings in the Study Tasks pane, or click () to open the Process Settings Wizard. Click Next to display the Profile Settings page; click Advanced options; click Edit in the Solver parameters area; and click the Microchip Options tab. Set the Perform wire sweep/paddle shift simulation in option to Autodesk Simulation Moldflow Insight.