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Molding material
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Select and edit the material to analyze. |
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Mold material
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Allows you to select and edit the mold material to be used during the analysis. You can specify the density, specific heat, and thermal conductivity of the mold material. |
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Compression press controller
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Allows you to select and edit a process controller to control the injection molding process during the analysis. |
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Wire material
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Allows you to select and/or edit a predefined compression press controller to be used for the Injection-compression analysis. |
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Leadframe material
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Allows you to select and/or edit the wire material to be used in the microchip encapsulation process. |
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Process controller
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Allows you to select and/or edit the leadframe material to be used in the microchip encapsulation process. |
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Solver parameters
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Allows you to select and edit the solver parameters to be used during the analysis. For example, you can configure intermediate results, mold/melt convergence criteria, and analysis restart settings. |
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Injection molding machine
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Select and edit an injection molding machine to simulate your molding machine during the analysis. You can configure the injection unit, hydraulic unit, and clamping unit. |