This dialog is used to specify the heat transfer coefficient (HTC) between the mold and the material. The HTC is used in Fill+Pack and Cool analyses by Midplane and Dual Domain solvers.
You can set different values for the HTC based on the time since the start of the cycle. You can set a different HTC profiles for both the core and the cavity, for example, to model molding processes where the core is made from a different material than the cavity, or where the part remains in the cavity after the mold separates and before ejection.