Setting up a Microchip Encapsulation analysis

The following table summarizes the setup tasks required to prepare a Microchip encapsulation analysis of a thermoset encapsulant.

Setup task Analysis technology
Meshing the model 1 Midplane Dual Domain 3D
Importing a C-Mold * fem file Midplane Dual Domain
Molding processes Midplane Dual Domain 3D
Analysis sequence 2 Midplane Dual Domain 3D  
Selecting a material 3 4 Midplane Dual Domain 3D
Microchip wires Midplane Dual Domain 3D
Leadframe Midplane Dual Domain 3D
Injection locations Midplane Dual Domain 3D
Process settings Midplane Dual Domain 3D

Optional setup tasks

Setup task Analysis technology
Runner balance constraints 5 Midplane Dual Domain
Setting venting analysis locations 3D
Parent topic: Microchip Encapsulation analysis types and analysis technologies
1 Mesh the model and mesh cavity, runner, leadframe and wire.
2 To complete a Warp analysis for Midplane or Dual Domain analysis technology, you must select an analysis sequence that includes the Compressible solver.
3 Select an encapsulation molding compound when selecting a material for this analysis.
4 To complete a Warp analysis for Midplane or Dual Domain analysis technology, you must select a material that includes pvT properties data.
5 Only for Runner Balance analyses.