This page of the Process Settings Wizard, which can be accessed by clicking 
(), is used to specify the stress analysis related process settings for the selected analysis sequence.
Stress analysis is available only for Midplane analysis technology. The Process Settings Wizard-Stress Settings page appears only if the selected analysis sequence includes Stress analysis. Depending on the analysis sequence, it may be necessary to click Next one or more times on the Process Settings Wizard dialog until the Stress Settings page appears.
Note: Some of the items listed below may not be available on the current dialog. This is dependent on the selected analysis sequence.
| Stress analysis type | Select the type of Stress analysis to run. |
| Stress result(s) to output | Specify which laminate-based stress-related results the solver will output. |
| Consider gate surface and cold runners? | Specify whether cold runners and/or gate surface elements, if present in your model, are taken into consideration during Warp or Stress analysis. |
| Matrix solver | Select the equation solver to be used in the Warp analysis. |
| Molding material | Select and edit the material to analyze. |