To prepare the model for a Microchip Encapsulation paddle-shift analysis, model the paddle together with the chip. The meshes, representing the paddle and the chip, will be separated internally during execution.
Set the molding process to Microchip Encapsulation click 
() and select an analysis sequence that includes Paddle Shift.
- Create the chip cavity model mesh. The chip cavity is modeled as upper and lower sub-cavities. This is the part mesh needed for the Fill+Pack analysis.
- Create the paddle mesh between the upper and lower chip cavities, in the Z-coordinate. This is the mesh needed for the Paddle Shift analysis.
- Select the paddle mesh elements and assign the properties.
- Click
(). - Click Select to display the list of property types that can be assigned. For a Midplane or Dual Domain mesh model, select
- For a Midplane or Dual Domain mesh model, select Leadframe from the list of property types for Triangular Element. Select the appropriate Leadframe property set from the Select Leadframe dialog, and check that the Details are correct.
- For a 3D mesh model, select Part insert (3D) from the list of property types for Tetrahedral Element. Select the appropriate Part insert (3D) property set from the Select Part insert (3D) dialog, and check that the Details are correct.
Tip: Define a new property set to describe the paddle and give it a unique name to distinguish it from the Part insert (3D) (default) property set.
- Click
- Click OK to close the Assign Property dialog You must set boundary conditions at points which will be clamped during encapsulation by applying constraints.