DOE Builder - Quality Criteria tab

This tab is used to select which analysis results you would like to study within the constraints you have selected in the Variables tab of the DOE Builder.

Fill+Pack . These criteria are available for all mesh types, except where otherwise noted.

Quality Criteria	Analysis Objective; to find conditions that
Bulk temperature at end of fill	minimize the bulk temperature variation (Midplane and Dual Domain mesh types only).
Clamp force	minimize the clamp force required to keep the mold closed during filling.
Injection pressure	minimize the pressure required by the ram to cause the material to flow, to 75% or less of the machine pressure limit when runners are included.
Shear stress	minimize shear stress, or friction, between layers of plastic flowing in the cavity, which can cause the plastic to degrade and fail due to stress cracks (Midplane and Dual Domain mesh types only).
Sink mark depth	minimize the depth of sink mark likely to be caused by features on the opposite face of the surface.
Temperature at flow front	minimize the flow front temperature variation, which should not drop more than 2-5°C during the filling stage.
Cooling time	minimize the cooling time, and thereby minimize the time to reach ejection.
Volumetric shrinkage at ejection	minimize the variation in volumetric shrinkage across the part, and thereby reduce warpage.
Time at end of packing	minimize the time taken to reach the end of packing, to optimize the cycle time (Midplane and Dual Domain mesh types, only).
Part weight/ mass	minimize the part weight (excluding runners), and thereby reduce cycle time and production costs.
Cool and Cool (FEM)	minimize the
	The following criteria are only available for Co-injection molding processes and Midplane meshes.
Volume of polymer A	minimize the volume of polymer A, and thereby ensure that there is sufficient space left for core material.
Volume of polymer B	maximize the volume of polymer B, and thereby ensure that the part is completely filled.
Weight of polymer A	minimize the weight of polymer A, and thereby ensure that there is sufficient space left for core material.
Weight of polymer B	maximize the weight of polymer B, and thereby ensure that the part is completely filled.

Cool and Cool (FEM) . These criteria are available for thermoplastic molding processes with all mesh types, except where otherwise noted.

Quality Criteria	Analysis Objective; to find conditions that
Average cavity surface temperature	minimize the average cavity surface temperature, to minimize the cycle time and optimize part quality (Cool (FEM) only).
Average mold surface temperature	minimize the temperature of the mold at the plastic/metal interface where plastic touches the mold, to optimize the cooling time.
Circuit pressure	minimize the circuit pressure, and thereby optimize the cooling system.
Circuit Reynolds number	minimize the variation in Reynolds number, and thereby optimize the coolant flow rate.
Part heat flux (top/ bottom)	minimize the variation in heat flux across the mold/part interface, to minimize cycle time and warpage.
Percentage frozen layer	minimize the percentage of frozen layer (Cool (FEM) only), to minimize the potential for warpage.
Percentage molten layer	minimize the percentage of molten layer (Cool (FEM) only), to minimize the potential for warpage.
Circuit coolant temperature	minimize the variation in the coolant temperature from coolant in to coolant out, which should not exceed 2-3°C.
Circuit metal temperature	minimize the variation in the temperature of the metal cooling circuit over the cycle, which should not exceed 5°C above the inlet temperature.
Mold surface temperature (top/ bottom)	minimize the variation in temperature of the mold at the plastic/metal interface, to minimize cooling and warpage problems.
Temperature difference, part	minimize the variation in temperature between the part top and bottom, which should not exceed 5°C (Midplane only).
Cooling time	minimize the variation in cooling time across the part, to optimize the cycle time.
Maximum part temperature	minimize the part temperature, to minimize cycle time and part warpage.
Cycle time	minimize the cycle time, and thereby maximize throughput and minimize costs.

Warp . These criteria are available for all mesh types.

Quality Criteria	Analysis Objective; to find conditions that
Deflection, all effects	minimize variations in deflection, to minimize warpage.

Stress . These criteria are available for thermoplastic molding processes with all mesh types, except where otherwise noted.

Quality Criteria	Analysis Objective; to find conditions that
Small deflection, stress	minimize variations in deflection, to minimize warpage.
Large deflection, stress	minimize variations in deflection to minimize warpage.
Maximum shear stress	minimize variations in shear stress between layers of plastic flowing in the cavity, which can cause the plastic to degrade and fail due to stress cracks.
Mises-Hencky stress	minimize variations in the Mises-Hencky stress, which can cause the plastic to degrade and fail due to stress cracks.

Shrink . These criteria are available for thermoplastic molding processes with Midplane and Dual Domain mesh types.

Quality Criteria	Analysis Objective; to find conditions that
Linear shrinkage	minimize variations in linear shrinkage.
Error in linear shrinkage	minimize variations in linear shrinkage.

Overmolding . These criteria are available for overmolding molding processes.

Quality Criteria	Comment
2nd shot, Bulk temp at end of fill	Midplane and Dual Domain only
2nd shot, Clamp force
2nd shot, Injection pressure
2nd shot, Shear stress	Midplane and Dual Domain only
2nd shot, Temp at flow front
2nd shot, Cooling time
2nd shot, Vol shrinkage at ejection
2nd shot, Time at end of packing	Midplane and Dual Domain only
2nd shot, Cycle time	3D only
2nd shot, Part mass/weight

Microchip Encapsulation . These criteria are only available for Microchip Encapsulation molding processes.

Quality Criteria	Comment
Paddle displacement	3D only
Von Mises stress	3D only
Wire sweep	Midplane and Dual Domain only
First principal stress, wire	Midplane and Dual Domain only
Wire shear stress	Midplane and Dual Domain only
Mises-Hencky stress, wire	Midplane and Dual Domain only
Wire sweep index	Midplane and Dual Domain only
In-plane wire sweep	Midplane and Dual Domain only
Paddle shift	Midplane and Dual Domain only
First principal stress, paddle	Midplane and Dual Domain only
Paddle shear stress	Midplane and Dual Domain only
Mises-Hencky stress, paddle	Midplane and Dual Domain only