This dialog is used to view/edit the properties of the selected underfill encapsulant material.
The Recommended Processing tab of this dialog is used to specify the recommended processing conditions for the underfill encapsulant material.
To access this dialog to view the properties of the currently selected encapsulant, right-click the Material Selection task in the Study Tasks pane and select Details.
To access this dialog to edit the properties of the currently selected material, double-click the Process Settings task in the Study Tasks pane, click Advanced options, then click the Edit button associated with the Underfill encapsulant option.
The collection of property values defined on the dialog are saved to a property set with the description shown in the Name box.
| Initial encapsulant temperature | Specify the temperature of the encapsulant at the start of the process as it enters the chip cavity. This temperature can be assumed to be the same as the substrate temperature in most cases. |
| Initial encapsulant temperature range | The Initial Encapsulant Temperature Range area displays the range of temperatures that can be used for the encapsulant material. The minimum Initial encapsulant temperature is displayed in the Tmin box, and the maximum Initial encapsulant temperature is displayed in the Tmax box. |
| Substrate temperature | Specify the temperature of the substrate during the process. The substrate temperature plays an important role in determining the underflow speed. A typical value for substrate temperature is 100°C / 212°F. |
| Substrate temperature range | The Substrate Temperature Range area displays the range of substrate temperatures that can be used for the material. The minimum substrate temperature is displayed in the Tmin box, and the maximum substrate temperature is displayed in the Tmax box. |