Running a wire sweep analysis

Ensure you have specified microchip encapsulation as your molding process.

  1. Click Analysis Sequence (Home tab > Molding Process Setup panel > Analysis Sequence).
  2. In the Select Analysis Sequence dialog, select Fill+Pack+Wire Sweep or Fill+Pack+Wire Sweep Detail and then click OK.
  3. If these options are not visible, click More to show additional analysis options.
  4. If necessary, double-click from the Study Tasks pane to change the Material properties.
  5. If necessary, double-click from the Study Tasks pane to edit the Process Settings properties.
  6. Click (Home tab > Analysis panel > Analyze in Cloud).
Parent topic: Wire sweep analysis