The Mold-melt temperature difference (bottom), part result is generated at the end of a Cool analysis on a Midplane part.
It shows the difference in temperature between the part side and mold side of the part/mold interface on the bottom side of the part. The bottom side is defined by the orientation of the mesh elements.
The difference in temperature is determined by the Mold-melt Heat Transfer Coefficients (HTC) values.
A lower HTC value represents a greater resistance to heat transer between the polymer and the mold.
Uneven part temperatures may result in warpage as the part cools after ejection. This may be because the mold surface is not conducting sufficient heat during molding.
To compensate for low mold conductivity, it may be necessary to add or alter cooling circuits to draw the extra heat away.