Temperature, parting plane (bottom) result

The Temperature, parting plane (bottom) result shows the average temperature of the parting plane on the side of the parting plane element that is designated as bottom.

Using this result

Parting planes are used to define the interface conductance between two pieces of the mold that are composed of the same material. There should be a small variation in temperature across the bottom and top faces of the parting plane and between the top and bottom faces. The greater the difference, the more influence the interface conductance has on the cooling of the part, which may contribute to the part being poorly cooled.

Note: If you use a cooling interface file for a Fill+Pack analysis, the mold temperature is defined as follows:
  • For a Dual Domain model, the average of the top and bottom temperature is used as the mold temperature.
  • For a Midplane model, the top temperature is used as the mold temperature.
The temperature of the mold should be as close as possible to the analysis target temperature.

Things to look for

Parent topic: Cool analysis results