This dialog is used to access the Microchip Encapsulation analysis related advanced options for the analysis sequence.
To access this dialog, ensure that you have selected the Microchip Encapsulation process and an analysis sequence that includes Wire Sweep and/or Paddle Shift. Click 
() to open the Process Settings Wizard dialog and then click Advanced options to open the Microchip Encapsulation Advanced Options dialog. If you have chosen an analysis sequence that uses the Incompressible solver, click Next to navigate to the Profile Settings page of the Wizard, and then click Advanced options.
| Molding material | Select and edit the material to analyze. |
| Process controller | Allows you to select and edit a process controller to control the injection molding process during the analysis. You can control the filling phase, velocity/pressure switch-over point, pack/holding phase, mold temperature and mold-open time. |
| Compression press controller | Allows you to select and/or edit a predefined compression press controller to be used for the Injection-compression analysis. |
| Injection molding machine | Select and edit an injection molding machine to simulate your molding machine during the analysis. You can configure the injection unit, hydraulic unit, and clamping unit. |
| Mold material | Allows you to select and edit the mold material to be used during the analysis. You can specify the density, specific heat, and thermal conductivity of the mold material. |
| Solver parameters | Allows you to select and edit the solver parameters to be used during the analysis. |