The Wire pairs within critical clearance result shows number of wire pairs for which the predicted clearance after wire deformation is equal to or less than the specified critical clearance value.
The Wire pairs within critical clearance result is generated by a 3D Microchip Encapsulation analysis when the selected analysis sequence includes Wire Sweep.
The plot shows the number and location of wire pairs for which predicted clearance between the wires is within the critical clearance.
Note: The Critical clearance between wires value is specified in the solver parameters. The default value is zero, indicating that the surfaces of adjacent wires can touch.
Using this result
Use this information to identify pairs of wires that are too close together after wire deformation occurs during cavity filling.
Note: In order to calculate the Wire pairs within critical clearance result, the wire sweep calculation must be performed in Autodesk Simulation Moldflow Insight.
Tip: This option is set on the
Microchip Options tab of the
Reactive Molding solver parameters (3D) dialog. Double-click
Process Settings in the Study Tasks pane, or click

() to open the
Process Settings Wizard. Click
Next to display the
Profile Settings page; click
Advanced options; click
Edit in the
Solver parameters area; and click the
Microchip Options tab. Set the
Perform wire sweep/paddle shift simulation in option to
Autodesk Simulation Moldflow Insight.