The 3D Cool solver performs Cool analyses on three-dimensional (tetrahedral) part meshes.
The analysis obtains a full three-dimensional transient finite-element solution for the temperatures of the part and is used for the calculation of the heat flux into the mold. These elemental heat fluxes are used as boundary conditions for the boundary element solution that calculates the surface temperatures of the mold.
The three-dimensional Cool analysis gives a fully time-dependent solution at every time step during the analysis. The analysis determines a highly accurate boundary condition set for the 3D Fill+Pack analysis, including polymer cooling rates. This is important because thick or solid parts often have a greater variation in mold temperature.
Due to full three-dimensional parts being solid in nature, assuming the part temperature is at the polymer melt temperature can be justified. If a part is a thin walled, then there is no benefit in running a 3D Cool analysis. The part then would have to be meshed so finely that it can be considered to be a solid part, comprising a huge number of tetrahedral elements. This huge number of elements will take an extremely long time to solve for filling, packing and cooling and provide no greater insight into mold cooling rates than a Midplane or Dual Domain analysis.
The 3D Cool solver provides actual surface temperatures for a mold during a 3D analysis. When a Midplane Cool analysis is performed, the solver calculates heat loss in the x and y directions, and makes no estimate in the z-direction. When a Dual Domain Cool analysis is performed, the solver makes an estimate of the heat loss in the z-direction. When a 3D Cool analysis is performed, the solver determines the heat loss in the x,y and z directions, providing a fully three-dimensional analysis result with actual cooling rates for the model.
It is suggested that 3D Cool be run before a 3D Fill+Pack analysis, with the results obtained from this analysis used as temperature or flux boundary conditions for the 3D-Filling analysis. When the 3D Cool analysis is performed, it will be assumed that the entire part is at melt temperature.
The Cool analysis will provide mold surface temperature variation information to the subsequent filling and packing analysis, resulting in more accurate Fill+Pack analysis results. This will help to identify any problems with the proposed cooling circuit design.