Predicting how a molten material flows in a mold, can be very complex. There are several models that have been developed to help with this prediction, which vary in the dependencies they consider and the molding process they address.
2-domain Tait pvT model
The modified 2-domain Tait pvT model is used to determine the density of the material as a function of the temperature and pressure. This variation impacts on many aspects of the flow simulation.
Cross-WLF viscosity model
The Cross-WLF viscosity model describes the temperature, shear rate, and pressure dependency of the viscosity.
Extension Viscosity model
The extension viscosity model describes the dependence of the viscosity on the shear rate, temperature, pressure, and extension rate in 3D flow. The extension viscosity coefficients are determined by using the shear viscosity model and experimental pressure measurements in convergent flow.
Herschel-Bulkley-WLF viscosity model
The Herschel-Bulkley-WLF viscosity model can be used for thermoset materials that show a yield stress. This model can be used in a Reactive Molding, Microchip Encapsulation, or Underfill Encapsulation analysis.
Juncture Loss model
A large pressure drop is often observed when the melt passes through contractions in the feed system, such as between the sprue, runners and gates, at the entrance of the die. Typically 85% of the pressure loss occurs at the entrance of the die, and 15% at the exit.
Matrix viscosity model
The matrix viscosity model is used to determine the viscosity from measured data supplied at specific temperatures, shear rates, and pressures.
Moldflow Second Order Viscosity model
The Moldflow second order viscosity model describes the temperature and shear rate dependence of the viscosity using a quadratic formulation.
Viscosity model for underfill encapsulation
The underfill viscosity model, which is a modification of the Herschel-Bulkley-WLF viscosity model for reactive materials, is used specifically for underfill encapsulants.
Reactive viscosity model
The reactive viscosity model describes the temperature, shear rate, and cure dependance of thermoset materials. This model can be used in a Reactive Molding, Microchip Encapsulation, or Underfill Encapsulation analysis.
N-th Order Kinetics model
The n-th order reaction kinetics (Kamal model) is used to calculate the curing behavior of a thermoset material in a Reactive Molding, Microchip Encapsulation, or Underfill Encapsulation analysis.
Mori-Tanaka micro-mechanics model
The Mori-Tanaka micro-mechanics model uses anisotropic matrix material properties to calculate mechanical properties of fiber filled composite materials, improving the prediction of shrinkage and warpage.
Dynamic surface tension model
Surface tension data is required to analyze this dispensing process in underfill encapsulation.
Coolant viscosity model
The viscosity, flow rate, and Reynolds number of a coolant are interrelated.
Gas diffusion model for Microcellular injection molding
The gas that was dissolved in the polymer melt in the initial step of the Microcellular injection molding process will diffuse out of the melt in the foaming stage, nucleating and growing bubbles in the process.