This page of the Process Settings Wizard is used to specify the underfill encapsulation related process settings for the analysis sequence. To access this dialog, ensure that the molding process has been set to Underfill Encapsulation. Click 
() to open the Underfill Encapsulation Settings dialog.
| Initial encapsulant temperature | Specify the temperature of the encapsulant at the start of the process as it enters the chip cavity. This temperature can be assumed to be the same as the substrate temperature in most cases. |
| Initial encapsulant conversion | Specify the initial conversion (curing) level of the encapsulant before the start of the process. To specify the level of conversion, enter a value between -1 and 1 where:
|
| Substrate temperature | Specify the temperature of the substrate during the process. The substrate temperature plays an important role in determining the underflow speed. A typical value for substrate temperature is 100°C / 212°F. |
| Curing temperature | The temperature at which a thermoset material will become sufficiently cross-linked from heating to form a solid, or cure. |
| Curing time | The time taken for a thermoset material to become sufficiently cross-linked from heating to form a solid and freeze. |
| Dynamic dispensing analysis | Check this box to enable dynamic dispensing. Dynamic dispensing allows you to simulate underfill encapsulation dispensing that is completed over several passes, and where each injection location is open at a different time to account for the time delay during dispensing. The option to Perform dynamic analysis is available only for 3D models. |
| Advanced options... | Displays the advanced options for the analysis. |