Wire pairs within critical clearance result

The Wire pairs within critical clearance result shows number of wire pairs for which the predicted clearance after wire deformation is equal to or less than the specified critical clearance value.

The Wire pairs within critical clearance result is generated by a 3D Microchip Encapsulation analysis when the selected analysis sequence includes Wire Sweep.

The plot shows the number and location of wire pairs for which predicted clearance between the wires is within the critical clearance.

Note: The Critical clearance between wires value is specified in the solver parameters. The default value is zero, indicating that the surfaces of adjacent wires can touch.

Using this result

Use this information to identify pairs of wires that are too close together after wire deformation occurs during cavity filling.

Note: In order to calculate the Wire pairs within critical clearance result, the wire sweep calculation must be performed in Autodesk Moldflow Insight.