A Microchip Encapsulation analysis can be one of several different types.
The pre-conditioning analysis calculates the temperature and degree of cure distribution of the epoxy molding compound (EMC) preform after it is placed in the pot and before it is transferred into the mold. Typically, the temperature of the transfer pot is higher than the temperature of the preheated preform, and the preform experiences changes in temperature and degree of cure while it is in the pot. The pre-conditioning analysis calculates the average temperature and degree of cure of the preform and passes the data to the subsequent filling and curing analysis. Optionally, you can omit the pre-conditioning analysis if you do not have data for it.
The mold-filling and curing analysis is performed by Reactive Molding.
The Wire Sweep analysis calculates the deformation of the bonding wires (connecting the chip to the leadframe) that occurs during encapsulation. This calculation enables you to improve the mold design and process conditions to prevent wire-sweep from occurring during encapsulation. The wire deformation can be calculated either internally in Autodesk Moldflow Insight using the Warp module or externally using Abaqus.
3D Microchip Encapsulation also supports a Wire Sweep Detail analysis, which accounts for the effects of the wires on the fluid flow as well as the effects of the fluid on the wires. The 3D chip cavity model must include the wire cavities as well as the wires themselves. The Wire Sweep Detail analysis takes more time to complete compared to the regular Wire Sweep analysis, but the calculation of deformation can be more accurate.
The Paddle Shift analysis calculates the deformation of the paddle due to the pressure difference in the two sub-cavities separated by the leadframe. Microchip Encapsulation calculates the pressure in the cavity. The leadframe deformation due to pressure differences in the cavity can be calculated either internally in Autodesk Moldflow Insight using the Warp module or externally using Abaqus.
3D Microchip Encapsulation also supports a Dynamic Paddle Shift simulation where the paddle shift is recalculated several times during filling. This analysis can provide a more accurate prediction of the final paddle shift when large deformations occur. The dynamic paddle shift analysis includes an option to perform Core shift analysis during pressure iteration, which is valid if the paddle has been modeled using 3D elements. However, if the paddle has been modeled using shell elements, the additional Core shift analysis cannot be performed.