The Microchip Encapsulation analysis simulates the encapsulation of semiconductor chips with reactive resins, which provides protection from hostile environments, facilitates heat dissipation, and enables electrical interconnection of the chips.
The Microchip Options tab of the Solver Parameters dialog is only available for microchip encapsulation molding processes, using a 3D mesh type. Here, you can select the stress analysis type, define the viscosity cut-off temperature, specify the insert temperature and choose in which product to perform the wire sweep/ paddle shift simulation.