This setting is available for microchip encapsulation analyses using Midplane or Dual Domain mesh types.
The Wire Sweep analysis calculates the deformation of the bonding wires (connecting the chip to the leadframe) that occurs during encapsulation. This calculation enables you to improve the mold design and process conditions to prevent wire-sweep from occurring during encapsulation.
The Paddle Shift analysis calculates the deformation of the paddle due to the pressure difference in the two sub-cavities separated by the leadframe. Microchip Encapsulation calculates the pressure in the cavity.
The deformation can be calculated either internally using the Warp module, or externally using Abaqus.
3D Microchip Encapsulation also supports a Dynamic Paddle Shift simulation where the paddle shift is recalculated several times during filling. This analysis can provide a more accurate prediction of the final paddle shift when large deformations occur. The dynamic paddle shift analysis includes an option to perform Core shift analysis during pressure iteration, which is valid if the paddle has been modeled using 3D elements. However, if the paddle has been modeled using shell elements, the additional Core shift analysis cannot be performed.