Problem Description

• This tutorial uses the meshed model created in the Circuit Board CAD Model tutorial.  If this tutorial was not completed, use the Meshed Circuit Board.ach archive file in your tutorial models folder.
• The chip is made of silicon.
• The circuit board is a copper clad FR4 grade glass reinforced epoxy laminate. For a simplified analysis example, the assumed properties are an average of the transverse and in-plane properties of the laminate and the isotropic properties of the copper conductor tracks. A 90%/10% proportion of laminate to copper, respectively, is assumed. The resultant conductivity is 0.549 W/(in·°F).
• The edge connectors are a combination of polyphenylene sulfide (PPS) plastic and copper conductors. Again, the thermal properties are averaged based on an assumed 90%/10% proportion of plastic to copper, respectively. The resultant thermal conductivity is 0.544 W/(in·°F).
  Note: You could perform a more precise simulation by including the metallic and non-metallic parts of the board and edge connectors as separate parts, assigning the appropriate properties to each. For a simpler CAD model construction and analysis example, we use the weighted average of the properties and treat each component as a single, monolithic material.
• The exposed portion of the top surface of the board and all of the exposed surfaces of the chip and edge connectors transfer heat through convection to an ambient temperature of 80°F with a convection coefficient of 0.0085 W/(in²·°F).
• Assume that the bottom and the four edges of the board are insulated (no convective heat losses at these surfaces).
• The chip has a total internal heat generation of 5 W.  

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