Selecting a wire material

For a Microchip Encapsulation analysis, you can select the wire material for your model as part of specifying the process settings for the analysis.

This topic assumes that the Microchip Encapsulation molding process has already been set.

1. Click (Home tab > Molding Process Setup panel > Analysis Sequence), and select a sequence that includes Wire Sweep analysis
2. Click (Home tab > Molding Process Setup panel > Process Settings), or double-click the Process Settings icon in the Study Tasks pane.
3. On the Process Settings Wizard-Microchip Encapsulation Settings page, click Next.
4. On the Process Settings Wizard-Profile Settings page, click Advanced options.
5. In the Advanced Options dialog, in the Wire material drop-down list, select the wire material. Click Edit to change the properties of the selected wire material.
6. Click OK in the Advanced Options dialog, and click Finish to close the Wizard.

Tip: To edit the wire properties at a later time, select the wire(s) on the model, right-click and select Properties.