The Wire-sweep index result is a representation of the force created by the flow of plastic past the wires of an integrated circuit.
The Wire-sweep index result is generated by a Microchip Encapsulation analysis.
A wire-sweep index is calculated and plotted for each wire, as follows:
- The analysis finds the point on the wire where displacement in the planar direction is greatest. Note: With Dual Domain analysis technology, the point that has the maximum displacement of the whole wire is used. With 3D analysis technology, nodes in each segment that have the maximum displacement in that segment are used.
- It divides this maximum displacement by the length of the wire.
- The result is the wire-sweep index for the individual wire.
Note: In order to calculate the Wire sweep index result, the wire sweep calculation must be performed in Autodesk Moldflow Insight.
Tip: Edit the Microchip Options Solver parameters by clicking 
(), Profile Settings page, Advanced Options button, Solver parameters area, then click Edit to display the Reactive molding solver parameters dialog. Select the Wire Sweep/Paddle Shift tab. Set the Perform wire sweep/paddle shift simulation in drop down box to Autodesk Moldflow Insight.
(), Profile Settings page, Advanced Options button, Solver parameters area, then click Edit to display the Reactive molding solver parameters dialog. Select the Wire Sweep/Paddle Shift tab. Set the Perform wire sweep/paddle shift simulation in drop down box to Autodesk Moldflow Insight.