Problem Description

• Enable surface-splitting in Simulation Mechanical prior to opening the CAD model. This option is off by default.
  Note: Surface splitting is required to separate the surface of the board under the chip and under each edge connector from the rest of the circuit board surface. In the subsequent thermal analyses, a convection load will be applied to the exposed surfaced of the board. The convection load should not be applied to the contact surfaces between the edge connectors and the board or the chip and the board.
• Use the CAD model, Circuit Board.igs, provided within your tutorial models folder.
• Return the surface-splitting option to its default setting.
• Solid mesh the model using an absolute mesh size of 0.15 inch.

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