Apply the Convection Load to the Board

1. With the Selection Shape Point or Rectangle and Selection Select Surfaces commands active, click the top surface of the board.
2. Click Setup Thermal Loads Convection.
   1. In the Convection Coefficient section, type 0.0085 in the Temperature Independent Convection Coefficient input field.
   2. In the Ambient Temperature section, type 80 in the Temperature input field.
   3. Click OK to apply the convection load to the model.

Note: Surface-splitting was enabled when the CAD model was opened in Simulation Mechanical (in the Mesh Circuit Board CAD Model tutorial). Therefore, the convection load is applied only to the exposed portion of the top surface. The portions under the chip and edge connectors are separate surfaces because the surface-splitting option splits surfaces where they intersect the edges of adjacent parts in an assembly.

In Simulation Mechanical, exposed surfaces with no thermal load applied to them are considered to be perfectly insulated. No heat flows into or out of the surfaces. Of course, heat can flow through the interface surfaces where two parts meet. (That is, heat flows from one part to another where they touch).

Next