The deflection results show the deflection at each node of the part (Warp or Stress analysis), or of the wire or paddle ( Microchip Encapsulation analysis). Use the Plot Properties dialog, Deflection tab to alter the deflection plot so you can examine the result.
There are a number of possible variants of the deflection result according to paddle (Microchip Encapsulation analysis), based on a best fit:
The result name indicates whether a small deflection or large deflection analysis was run. If it is not indicated in the result name, then a small deflection analysis was run.
You can view the net deflections at each node, or the component of the deflection along either the X, Y or Z axis. The axis directions are determined by the defined anchor plane and are indicated in the anchor plane symbols.
There are four sets of deflection results.
The net deflection plot shows you the total predicted deformation of the part, based on the default best fit technique, or on a user-defined anchor plane.
Use the
Examine Result tool to see the coordinates of selected nodes before and after deformation, and to see the distance between two successively selected nodes, before and after deformation.
A warp analysis with the Isolate cause of warpage option activated outputs not only the total deflection results but also breaks down the total deflections according to defined contributors to warpage: differential shrinkage, orientation effects and differential cooling. Midplane and Dual Domain analyses can also display warpage due to corner effects. The contributor with the largest deflection values can be regarded as the dominant cause of warpage. Having identified the dominant cause of warpage, specific measures can then be taken to attempt to reduce the overall warpage based on the particular cause.