Heat treatment modeling is a beta feature. Heat treatment must be used in conjunction with part level plasticity via the *PPLA card. To simulate heat treatment two cards are required: *STRF to set the heat treatment schedule, and *STRR to set the annealing temperature for one or more materials.
Heat treatment can be modeled before or after either build plate or support structure removal, and in any combination thereof using *HTOR and *HTAT, along with the additional heat treatment schedule(s) required via *STR1 and *STR2.