Injection Location for Reactive Processes dialog
The General tab of this dialog is used to specify values for certain inputs common to all reactive processes.
| Dialog element - General tab | Explanation |
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| Select and edit the material to analyze. |
| Allows you to select and edit the mold material to be used during the analysis. You can specify the density, specific heat, and thermal conductivity of the mold material. |
| Allows you to select and edit a process controller to control the injection molding process during the analysis. |
| Allows you to select and/or edit a predefined compression press controller to be used for the Injection-compression analysis. |
| Allows you to select and/or edit the wire material to be used in the microchip encapsulation process. |
| Allows you to select and/or edit the leadframe material to be used in the microchip encapsulation process. |
| Allows you to select and edit the solver parameters to be used during the analysis. For example, you can configure intermediate results, mold/melt convergence criteria, and analysis restart settings. |
| Select and edit an injection molding machine to simulate your molding machine during the analysis. You can configure the injection unit, hydraulic unit, and clamping unit. |
| Dialog element - Underfill tab | |
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| Click Edit to edit the properties of the default underfill encapsulant, or click Select to choose an alternate underfill encapsulant from the supplied database. |
| Allows you to select and edit a pre-saved set of processing conditions for the Underfill Encapsulation process. |