The Microchip Encapsulation analysis simulates the encapsulation of semiconductor chips with reactive resins, which provides protection from hostile environments, facilitates heat dissipation, and enables electrical interconnection of the chips.
The reactive nature of the thermosetting encapsulants (typically epoxy molding compounds), and the complex geometries (with molded-in silicon chip paddles, connecting wires and leadframes) pose problems for product design, material selection, tool making, and process control.
Microchip Encapsulation helps solve these problems by providing the tools to design the encapsulation package, tool, leadframe and wires, and to select optimal processing conditions, including mold temperature, filling time, ram-speed profile, and curing time.
Microchip Encapsulation analysis can:
[1] To complete a Warp analysis for Midplane or Dual Domain analysis technology, you must select an analysis sequence that includes the Compressible solver