Set convergence criteria for entities to specify the result type and maximum number of refinements to reach convergence.


Global (left) and Local (right) mesh convergence results
For more information, see Mesh Convergence.
This new load type enables you to analyze hydrostatic fluid pressure that varies with the depth of fluid in a particular direction. Pressure is always normal to an element face.
For more information, see Hydrostatic Load, and the Flat Walled Tank Exercise, which has been revised to demonstrate a hydrostatic load.
Autodesk Inventor Nastran can use Vault as a convenient way to store and manage project results. When Inventor and Vault are both installed on a computer or network, the Vault tab appears in Inventor.

The parts for a project must be stored in a Vault project folder, and then opened in Inventor for analysis. Inventor Nastran analysis results are stored in a PKG file, inside a '3rd Party' folder for each part on the Inventor Model Tree, as shown above. Anyone opening the part or assembly in Inventor Nastran can load the analysis results from the Results node on the Analysis tree:

The Vault PKG file can be updated by right-clicking the Analysis node on the Nastran Model Tree:

The Constraints section of the Inventor Nastran ribbon provides direct access to Pin and Frictionless constraint types.

Inventor Nastran now uses one consistent units system for the ribbon bar, Analysis Tree, and Model Tree. In previous releases, the ribbon bar and Model Tree used the units defined with the model.
Commands are now available to create or delete a new analysis and a new subcase.
Saving an Inventor Frame Generator model now takes much less time in the Inventor Nastran environment. An issue with solids not being hidden properly has also been resolved, and the new version avoids the improper selection of sketch entities.
The tables for Young's Modulus vs. Temperature and Thermal Conductivity vs. Temperature have been replaced with a Load Scale Factor vs. Temperature table. Load scale factor is a multiplier to Young's modulus and thermal conductivity.