Microchip encapsulation molding analysis sequences

The following analysis sequences are available for the microchip encapsulation molding process:

This molding process simulation is available for the following mesh types:

Analysis sequenceMesh type
Fill (Compressible)
Fill + Pack
Fill + Pack (Compressible)
Flow (Incompressible)
Fill + Pack + Warp
Fill + Pack + Warp (Compressible)
Fill + Pack + Wire Sweep
Fill + Pack + Wire Sweep (Compressible)
Flow + Wire Sweep (Incompressible)
Fill + Pack + Wire Sweep Detail
Fill + Pack + Paddle Shift
Fill + Pack + Paddle Shift (Compressible)
Flow + Paddle Shift (Incompressible)
Fill + Pack + Dynamic Paddle Shift
Fill + Pack + Paddle Shift + Wire Sweep
Fill + Pack + Wire Sweep + Paddle Shift (Compressible)
Flow + Wire Sweep + Paddle Shift (Incompressible)
Fill + Pack + Dynamic Paddle Shift + Wire Sweep
Runner Balance (Compressible)
Runner Balance (Incompressible)
Cool (FEM)
Cool (FEM) + Fill + Pack
Cool (FEM) + Fill + Pack + Warp
Cool (FEM) + Fill + Pack + Wire Sweep
Cool (FEM) + Fill + Pack + Wire Sweep Detail
Cool (FEM) + Fill + Pack + Paddle Shift
Cool (FEM) + Fill + Pack + Dynamic Paddle Shift
Cool (FEM) + Fill + Pack + Paddle Shift + Wire Sweep
Cool (FEM) + Fill + Pack + Dynamic Paddle Shift + Wire Sweep
Related: Flow refers to the analysis sequence, Fill + Pack.
Note: For 3D mesh types, there is no option to select compressible or incompressible, because the analysis run depends on the pvT data entered.

You can also run a Venting analysis ( only) by selecting the option in the Venting analysis tab of the solver parameters dialog, which can be accessed through the Process Settings Wizard.