The following analysis sequences are available for the microchip encapsulation molding process:
This molding process simulation is available for the following mesh types:
Analysis sequence | Mesh type |
---|---|
Fill (Compressible) | ![]() ![]() |
Fill + Pack | ![]() ![]() ![]() |
Fill + Pack (Compressible) | ![]() ![]() |
Flow (Incompressible) | ![]() ![]() |
Fill + Pack + Warp | ![]() ![]() ![]() |
Fill + Pack + Warp (Compressible) | ![]() |
Fill + Pack + Wire Sweep | ![]() ![]() ![]() |
Fill + Pack + Wire Sweep (Compressible) | ![]() ![]() |
Flow + Wire Sweep (Incompressible) | ![]() ![]() |
Fill + Pack + Wire Sweep Detail | ![]() ![]() ![]() |
Fill + Pack + Paddle Shift | ![]() ![]() ![]() |
Fill + Pack + Paddle Shift (Compressible) | ![]() ![]() |
Flow + Paddle Shift (Incompressible) | ![]() ![]() |
Fill + Pack + Dynamic Paddle Shift | ![]() ![]() ![]() |
Fill + Pack + Paddle Shift + Wire Sweep | ![]() ![]() ![]() |
Fill + Pack + Wire Sweep + Paddle Shift (Compressible) | ![]() ![]() |
Flow + Wire Sweep + Paddle Shift (Incompressible) | ![]() ![]() |
Fill + Pack + Dynamic Paddle Shift + Wire Sweep | ![]() ![]() ![]() |
Runner Balance (Compressible) | ![]() ![]() |
Runner Balance (Incompressible) | ![]() ![]() |
Cool (FEM) | ![]() ![]() ![]() |
Cool (FEM) + Fill + Pack | ![]() ![]() ![]() |
Cool (FEM) + Fill + Pack + Warp | ![]() ![]() ![]() |
Cool (FEM) + Fill + Pack + Wire Sweep | ![]() ![]() ![]() |
Cool (FEM) + Fill + Pack + Wire Sweep Detail | ![]() ![]() ![]() |
Cool (FEM) + Fill + Pack + Paddle Shift | ![]() ![]() ![]() |
Cool (FEM) + Fill + Pack + Dynamic Paddle Shift | ![]() ![]() ![]() |
Cool (FEM) + Fill + Pack + Paddle Shift + Wire Sweep | ![]() ![]() ![]() |
Cool (FEM) + Fill + Pack + Dynamic Paddle Shift + Wire Sweep | ![]() ![]() ![]() |
You can also run a Venting analysis ( only) by selecting the option in the Venting analysis tab of the solver parameters dialog, which can be accessed through the Process Settings Wizard.