Cool analysis products

The Cool analysis products are heat transfer simulations used to analyze the flow of heat in plastic injection molds.

The Cool analysis products include:

Steady state cool - for optimizing the design of the part

The steady-state cool simulation analyzes both the temperature of the part and the temperature of the mold, calculating a cycle averaged temperature distribution in the mold, in order to optimize various aspects of the design of the part, including cooling time, cycle time, part design, and mold design.

Steady state cool analyses are supported by the following mesh types:

• Midplane

• Dual Domain

• 3D

  There are two different 3D solutions from which to select; Cool, using the Boundary element method or Cool (FEM), using the Finite element method.

Transient cool-for analyzing mold temperature distributions

Transient cool analyses are used to simulate the change in mold temperature with time.

Transient cool analyses are supported by the following mesh types:

• Dual Domain - using the Cool (FEM) solution.
• 3D - using the Cool (FEM) solution.

and by the following processes:

• Thermoplastics injection molding (Dual Domain and 3D)
• Reactive molding (3D only)
• Microchip encapsulation (3D only)
• RTM or SRIM (3D only)

Conformal cooling - for analysing complex cooling systems

The targeted removal of heat from a part can be achieved using conformal cooling. Instead of using the traditional tube-like cooling systems, molds can be manufactured with complex cooling shapes and cross-sections that closely follow the contours of the part.

Conformal cooling channels must first be modeled within a CAD package and then imported into the study.

Conformal cooling analyses are supported for parts using the following mesh types.

• Dual Domain - using the Cool (FEM) solution.
• 3D - using the Cool (FEM) solution.