Auto-pour controls when copper pours re-fill. It is on by default, so the pours re-fill each time you edit the design. On a large board, each re-fill takes time. Turn auto-pour off to work without that delay.
On the PCB Design toolbar, click Copper Pour > Auto-pour all Copper Pours. The setting applies to every copper pour in the design.
The pours no longer re-fill on their own. The copper stays as it was until you re-fill it yourself.
Click Re-fill Copper Pours to update the copper when you are ready. See Refill polygon pours.
Turn auto-pour back on to re-fill every pour at once.
SET AUTO_COPPER_POUR ON or SET AUTO_COPPER_POUR OFF in the command line.