Place Surface-mounted component pads

1. Open a New Electronics Library.
2. In the New Electronics Library workspace click Create > New Footprint.
3. In the Add Footprint dialog, name the new footprint or import an existing one. Place the new pad on the footprint.
4. On the Library Footprint toolbar, click Place > SMD Pad .
5. In the SMD Pad dialog, set the properties for each pad:
   • Angle: Set a custom orientation angle or choose an angle from the list.
   • Size: Set a custom size or choose a size from the list.
   • Roundness: Set the roundness of the pad corners. The higher the percentage, the larger the corner curves.
6. Apply Solder Mask:
   • Auto: Use the default solder mask values specified in Design Preferences.
   • Off: Disable solder mask openings. The solder mask will cover the pads entirely.
   • Offset: Set a custom size or choose a size from the list. If the custom values exceed Design Preferences limits, they will automatically adjust to the allowed limits on the 2D PCB.
7. Apply Stencil:

   • Auto: Use the default stencil values specified in Design Preferences.

   • Off: Disable the stencil.

   • Percentage Reduction: Set the stencil coverage by reducing the pad area by a percentage. For large pads, choose between 2x2 or 3x3 grids.

   • Offset Reduction: Set a custom offset size to reduce the stencil area or choose a size from the list.

     If offset and percentage values exceed Design Preferences limits, they will automatically adjust to the allowed limits on the 2D PCB.

8. Click Done to place the pad.

Note: Pads are automatically assigned a name according to the sequence in which they are placed.