Place via

  1. In the 2D PCB workspace, click Route > Via Via icon.

  2. In the VIA dialog, set the properties for each via:

    • Via Length: Choose a via length from the list.
    • Pad Shape: Choose from square, round, or octagon.
    • Dimensions: Use auto to set default values. Set custom dimensions or choose dimensions from the list.
  3. Apply Solder Mask.

    • Auto: Size the opening with the solder mask opening rule. Fusion also tents the via automatically when the rule's Auto Tent option is on and the via is small enough.
    • Offset: Set a custom opening size. If the value falls outside the rule's range, Fusion adjusts it when Auto Resize is on, or reports a DRC error when Auto Resize is off.
    • Tented: Cover the via entirely with solder mask.
  4. Use the cursor to place the vias. If any selected location violates design rules, the via is automatically moved to the nearest acceptable location.

  5. Click Done to finish placing vias.

Note: After you route to vias, you can strengthen trace-to-via junctions with the teardrop rules in Design Rules.