The electronics cooling study in Fusion simulates the temperature that components on an electronics board are likely to reach, to help you determine whether PCB components are at risk of failure due to overheating. There is no need to simplify the components or model the air volume surrounding them, as these tasks are performed automatically by the solver.
Open an electronics design that was created in Fusion, or in another CAD package.
Click the workspace switcher and select the Simulation workspace.
In the New Study dialog, select Electronics Cooling as the Study Type.
In the New Study dialog, click Create Study to open the new electronics cooling study in the Simulation workspace.
In the Setup tab, click (Materials panel > Materials) to apply, view, or edit the materials.
In the Setup tab, click (Loads panel > Thermal Load) to apply the Internal Heat loads.
If your model includes a fan, select the fan body, then click (Cooling panel > Fan) to apply a volumetric air or fluid flow.
If your model includes heat sinks, select the heat sink body, then click (Cooling panel > Heat Sink) to create an idealized representation of the extruded heat sink design.
If you want to highlight PCB components that are at risk of overheating, click (Thresholds panel > Temperature Thresholds) to set the temperature threshold on those components.
If a MAXTEMP attribute were set on a component in the electronics design, this value populates the temperature threshold value for that component, automatically.
If Pre-check shows the study set up is ready, click
(Solve panel > Solve) to run the analysis.
When the analysis is complete, click (Results panel > Results) to view the results.