Objects such as heaters, boilers, electronic devices, and circuitry all generate heat and require thermal management to prevent injury and premature failure. Thermal simulations provide a visual representation of the temperature and airflow in and around objects, so you can optimize your design to reduce power consumption and cost, and maximize safety and the lifetime of your product.
Thermal loads are heat forces applied to model components. In addition to the three heat transfer mechanisms; conduction, convection, and radiation, there are three more loads; internal heat, heat source, and applied temperature, that can add heat to, or remove heat from your analysis. These loads apply a specific amount of thermal energy, instead of using physics, to transfer the heat.
Load | Study Type | Applies to... | Used to... |
---|---|---|---|
Applied Temperature | Thermal, Thermal stress | Faces, edges, and vertices. When selecting more than one input, all inputs must be the same entity type. |
Lock selected entities to a specified temperature, allowing an infinite amount of energy to be generated or removed to maintain the specified temperature. |
Heat Source | Thermal, Thermal stress | Faces, edges, and vertices. When selecting more than one input, all inputs must be the same entity type. |
Impose a specific amount of heat, that passes through the surfaces, directly on faces, edges, or vertices. |
Radiation | Thermal, Thermal stress | Face | Simulate radiative heat transfer between one or more surfaces and the surrounding environment. |
Convection | Thermal, Thermal stress | Faces | Simulate heat transfer between the ambient atmosphere (liquid or gas) and one or more faces of the model. |
Internal Heat | Thermal, Thermal stress, Electronics cooling | Body | Add or remove a specific amount of energy from a body. |